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UNIVERSITY OF BUCHAREST
FACULTY OF PHYSICS Guest
2024-11-23 18:27 |
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Conference: Bucharest University Faculty of Physics 2017 Meeting
Section: Physics and Technology of Renewable and Alternative Energy Sources
Title:
Non-destructive evaluation of special electronic components
Authors:
Elena-Mădălina FLORESCU (1), Ioan STAMATIN (2), Sanda VOINEA(2)
Affiliation:
1) Microelctronica SA, 126 Iancu Nicolae,Voluntari, Ilfov, Romania
2)University of Bucharest, Faculty of Physics, P.O.Box MG-11, Magurele, 077125 Bucharest, Romania
E-mail
madalina.florescu@microel.ro
Keywords:
aerospace, electronic packaging, non-destructive analysis, X-ray tomography
Abstract:
Some of the electronic components are used in special applications, for example, in the aerospace high technology domain. A key aspect of these special electronics is the packaging. There are many packaging challenges imposed by the extreme environments of the aerospace. Even materials that have been used in standard electronic packaging applications for many years must be re-evaluated due to issues such as diffusion, degradation, and excessive stresses, which result from exposure to extreme conditions. A possible why to identify the causes of the issues is to put the assembly to non-destructive evaluation (NDE), to gain as much information as possible about the failure without modification. The objective of non-destructive is to gain as much information about a part or assembly as possible without causing any damage. Valuable information can be obtained using visual inspection, optical microscopy, X-ray computed tomography, scanning electron microscopy and other additional methods. By using the X-ray microscopy various internal defects can be determined, for example: presence of voids and their frequency, compositional variation, location of short and open circuits.
The paper includes information regarding a pressure sensor used in the aeronautics which was analysed by a X-ray computed tomography equipment.
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